The history of the Sn-Bi system solder metallurgy development will be related. Since solder paste is the key material for the formation of SMT solder joints between the components and boards in various board products in the computer industry, the various types of LTS solder pastes and their critical to function characteristics will be described. Physical and Microstructural Characteristics of BGA and BTC component solder joints will be illustrated. Results from various industry efforts to ascertain the Temperature Cycling fatigue induced damage, Mechanical Drop shock reliability, and Electromigration within such solder joints will be recounted. Examples of the proliferation of LTS in the electronics industry in general and current computer products will be listed. Future LTS research and development will also be discussed.