Program

Design, measurement Tuesday (Stage A)
10.20
Helping electronic innovation by ChipCAD Ltd. between 1996-2026
10.40
LoRaWAN sensor applications
11.00
Integrated AI bot specialized in debugging embedded systems
11.30
Mitutoyo metrology solutions for the electronics industry
Innovation in manufacturing – Soldering Tuesday (Stage A)
12.30
Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures
13.00
IPC Standards in Practice – J-STD-001, IPC-A-610, and the True Nature of Space & Military Quality
13.30
Manufacturing of flux-cored wires – trends and challenges in modern soldering technology
14.00
Maintenance Cleaning in the electronics industry
Engineering Education Tuesday (Stage A)
15.00
We always need an engineer!
Manufacturing support Tuesday (Stage B)
10.30
Importance of inspections in manufacturing
11.00
Progress through lasers
11.30
ASMPT SMT Solutions for AI and IT server applications
12.00
Production Solutions for electronic industries
Innovation in manufacturing II. Tuesday (Stage B)
13.00
High Performance Interconnects for Power Electronics with PINK Vacuum Systems
13.30
Introduction of Phoenix Mecano Kecskemét Kft.
14.00
EMC Shielding Concepts – From Fundamentals to Practical Implementation
14.30
Resilience in electronics manufacturing with Panasonic’s G series and processes in and beyond SMT
15.00
Basics of in-situ gaskets, FIPFG, and its automation process
Industry trends Wednesday (Stage A)
10.30
How a connected Central Europe could be the next winner of the EMS world
11.00
Lead with Nobel Prize winning knowledge! Lessons from ISO 56001 Innovation Management System and the newest Nobel Prize in economics.
11.30
Resilient Supply Chain Collaboration on Electronics and Technology with Taiwan
12.00
HCHiP – accessible semiconductor technology
12.30
Cybersecurity of digital products
AOI – MI Wednesday (Stage A)
13.30
DELVITECH - AI 4 AOI. Driven by AI, guided by vision.
14.00
vAI ProVision: Fast Inspection Program Creation for AOI & AXI
14.30
Intelligence in Motion: When AOI Starts Thinking
Design, Simulation Wednesday (Színpad B.)
10.00
From Rough Idea to Connected Schematic in Minutes: Supercharging Hardware Design with CELUS
10.30
Simulation solutions for cooling system design
11.00
Model-Based Development in Electronic Systems: Experiences, Tools, and Best Practices
11.30
Modeling options for identifying signal and power integrity and EMC issues
12.00
Why Not Simulating Is Expensive – The Business Case for Faster Development
Innovation in manufacturing III. Wednesday (Stage B)
13.00
Advanced Vapor Phase Soldering: Efficient, Void-Free and Flux-Free Soldering Solutions
Space and defense industry Thursday (Stage A)
10.30
Passive RF direction-finding systems against modern drone threats
11.00
Needs and challenges of drone-detection radars
11.30
Recent achievements in space research by 27G
12.00
Milestones and Challenges in Hungarian Rocket Development
12.30
Radiation test campaign of PCIe based BGA SSDs
13.00
Key Aspects of New Space Project Developments and Lesson Learnt
Automotive Thursday (Stage B)
10.00
The cybersecurity compliance of vehicles.

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